粘弾性積層体に生ずるエポキシ樹脂の硬化収縮における残留反り変形量の解明

URI http://harp.lib.hiroshima-u.ac.jp/it-hiroshima/metadata/8143
ファイル
タイトル
粘弾性積層体に生ずるエポキシ樹脂の硬化収縮における残留反り変形量の解明
別タイトル
Study on Residual Warpage with Curing Reaction of Epoxy Resin Caused in Viscoelasticity Laminated Body
著者
氏名 中村 省三
ヨミ ナカムラ ショウゾウ
別名 Nakamura Shozo
氏名 木村 建斗
ヨミ キムラ ケント
別名 Kimura Kento
キーワード
viscoelasticity
warpage
chemical reaction
thermal stress
epoxy resin
laminate body
NDC
578.4
抄録

Epoxy resin is usually used as an encapsulation of electronic parts. Epoxy resin is transformed from liquid to solid by the chemical curing reaction, and then residual stress and warpage are generated in the electronic parts. Therefore, the generation mechanism is clarified and it is necessary to establish the evaluation method. In this report, the chemical reaction of epoxy resin was generated and the amount of the warpage caused by the curing process was verified by the experiment. As a result, the simplified evaluation method of the amount of the warpage caused by the chemical reaction was established, and it was clarified that the experimental value of residual warpage could be explained by adding the value of curing warpage by the evaluation method and thermal warpage by the thermal viscoelastic analysis.

掲載雑誌名
広島工業大学紀要. 研究編
44
開始ページ
17
終了ページ
24
出版年月日
2010-02
出版者
広島工業大学
ISSN
1346-9975
NCID
AA11599110
本文言語
日本語
資料タイプ
紀要論文
著者版フラグ
出版社版
旧URI
区分
it-hiroshima