Study on Residual Warpage with Curing Reaction of Epoxy Resin Caused in Viscoelasticity Laminated Body
Epoxy resin is usually used as an encapsulation of electronic parts. Epoxy resin is transformed from liquid to solid by the chemical curing reaction, and then residual stress and warpage are generated in the electronic parts. Therefore, the generation mechanism is clarified and it is necessary to establish the evaluation method. In this report, the chemical reaction of epoxy resin was generated and the amount of the warpage caused by the curing process was verified by the experiment. As a result, the simplified evaluation method of the amount of the warpage caused by the chemical reaction was established, and it was clarified that the experimental value of residual warpage could be explained by adding the value of curing warpage by the evaluation method and thermal warpage by the thermal viscoelastic analysis.