粘弾性積層体の硬化収縮に起因する反り変形量を求める硬化予測式

URI http://harp.lib.hiroshima-u.ac.jp/it-hiroshima/metadata/8186
ファイル
タイトル
粘弾性積層体の硬化収縮に起因する反り変形量を求める硬化予測式
別タイトル
Curing Prediction Solution of Warp Deformation for Viscoelastic Laminated Body with Chemical Reaction
著者
氏名 中村 省三
ヨミ ナカムラ ショウゾウ
別名 Nakamura Shozo
氏名 田中 孝明
ヨミ タナカ タカアキ
別名 Tanaka Takaaki
キーワード
viscoelasticity
warp deformation
numerical analysis
chemical reaction
epoxy resin
laminate
NDC
501.4
抄録

Epoxy resin is usually used as an encapsulation of IC chips for electronic parts. As for the epoxy resin, a state changes from liquid to solid by the chemical reaction. Hereby, the residual stresses and the warp deformation occur in the electronic parts. In this report, the warp deformation for two laminated bodies consisting of epoxy resin and steel and epoxy resin and printed board, each of which is caused by chemical reaction and thermal load, was examined by the experiment and the theory. In other words, the theoretical contents are the thermo-viscoelastic analysis based on the linear viscoelasticity theory and a simple prediction solution about the laminated bodies consisting of the above-mentioned materials. As a result, it was clarified that the warp deformation for the laminated bodies generated by chemical reaction and thermal load could be predicted by using the combination of thermo-viscoelastic analysis and simple prediction solution which was derived from the bending theory of beam, and that the percentage of the warp deformation caused by chemical reaction was about 15 ~ 20% of the total warp deformation for the laminated bodies.

掲載雑誌名
広島工業大学紀要. 研究編
43
開始ページ
57
終了ページ
64
出版年月日
2009-02
出版者
広島工業大学
ISSN
1346-9975
NCID
AA11599110
本文言語
日本語
資料タイプ
紀要論文
著者版フラグ
出版社版
旧URI
区分
it-hiroshima