Curing Prediction Solution of Warp Deformation for Viscoelastic Laminated Body with Chemical Reaction
Epoxy resin is usually used as an encapsulation of IC chips for electronic parts. As for the epoxy resin, a state changes from liquid to solid by the chemical reaction. Hereby, the residual stresses and the warp deformation occur in the electronic parts. In this report, the warp deformation for two laminated bodies consisting of epoxy resin and steel and epoxy resin and printed board, each of which is caused by chemical reaction and thermal load, was examined by the experiment and the theory. In other words, the theoretical contents are the thermo-viscoelastic analysis based on the linear viscoelasticity theory and a simple prediction solution about the laminated bodies consisting of the above-mentioned materials. As a result, it was clarified that the warp deformation for the laminated bodies generated by chemical reaction and thermal load could be predicted by using the combination of thermo-viscoelastic analysis and simple prediction solution which was derived from the bending theory of beam, and that the percentage of the warp deformation caused by chemical reaction was about 15 ～ 20% of the total warp deformation for the laminated bodies.