エポキシ樹脂と鋼材からなる粘弾性積層はりの硬化過程における反り変形挙動

URI http://harp.lib.hiroshima-u.ac.jp/it-hiroshima/metadata/834
ファイル
タイトル
エポキシ樹脂と鋼材からなる粘弾性積層はりの硬化過程における反り変形挙動
別タイトル
Warp Deformation Behavior in Chemical Curing Process ofViscoelastic Laminated Beam Composed of Epoxy Resin and Steel
著者
氏名 中村 省三
ヨミ ナカムラ ショウゾウ
別名 Nakamura Shozo
氏名 篠原 司
ヨミ シノハラ ツカサ
別名 Shinohara Tsukasa
氏名 田中 孝明
ヨミ タナカ タカアキ
別名 Tanaka Takaaki
キーワード
viscoelasticity
warp deformation
Finite Element Method
numerical analysis
curing reaction
epoxy resin
NDC
501.4
抄録

Epoxy resin is usually used as a encapsulation of IC chips for electronic parts. It is transformed
from liquid to solid by the chemical curing reaction,and then residual stresses and warp deformation
are generated in the electronic parts. In this report,the warp deformation behavior of laminated beam
caused by the chemical curing process of epoxy resin was examined from both sides of the experiment
and theory, which are the thermo-viscoelastic numerical analysis based on the linear viscoelasticity
theory and the Finite Element Analysis about the laminated beam consisting of epoxy resin and steel.
As a result, it was clarified that the result of thermo-viscoelastic numerical analysis of warp
deformation well accorded with the experimental values,and the warp deformation behavior could be
predicted by the thermo-viscoelastic numerical analysis with precision which is effedive in practical
use.

掲載雑誌名
広島工業大学紀要. 研究編
42
開始ページ
25
終了ページ
31
出版年月日
2008-02
出版者
広島工業大学
ISSN
13469975
NCID
AA11599110
本文言語
日本語
資料タイプ
紀要論文
著者版フラグ
出版社版
旧URI
区分
it-hiroshima